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            <title><![CDATA[00939「秒填息」再創新高！26次全填息　Q3漲8%稱霸月配ETF]]></title>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台股第三季震盪加劇，月配息台股ETF表現卻逆勢突圍。統一台灣高息動能（00939）第三季以來股價上漲8%，居16檔月配息台股ETF之冠，1日迎來第26次除息，開盤隨即完成填息，終場更以23.26元改寫歷史新高，延續「能配又能漲」表現。]]></description>
            <pubDate>Wed, 02 Sep 2026 01:48:00 +0800</pubDate>
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            <title><![CDATA[台股走強高股息ETF同步上攻！00713股價衝新高　年化配息率逾8%]]></title>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台股走高帶動高股息ETF同步上攻，元大台灣高息低波（00713）1日股價突破62元、改寫歷史新高，本季最新配息金額也調升至1.25元，年化配息率約8.1%。統計今日高股息ETF，包括元大高股息（0056）、群益台灣精選高息（00919）、00713、元大台灣價值高息（00940）等9檔，股價創下或持平盤中新高。]]></description>
            <pubDate>Wed, 02 Sep 2026 01:36:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[Google突破AI記憶體牆！TPU v8首度訓練、推論分流　KV Cache壓縮6倍仍不夠]]></title>
            <link>https://news.nextapple.com/finance/20260902/23269F6A43694F6F841BBD3FC8F304C5</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI模型規模邁向兆級參數，運算瓶頸也從算力逐步轉向記憶體。Google供應鏈基礎設施資深總監Nikhil Cherian於SEMICON Taiwan 2026記憶體高峰論壇表示，Google已從受限於FLOPS算力，轉向受記憶體頻寬限制，記憶體更成為AI伺服器總持有成本（TCO）的主要驅動因素。為突破「記憶體牆」，Google同步從硬體、軟體及供應鏈著手，今年更首度同年推出訓練、推論兩款TPU，並透過TurboQuant演算法將KV Cache記憶體需求壓縮6倍。]]></description>
            <pubDate>Wed, 02 Sep 2026 01:27:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[38國齊聚晶鏈高峰論壇！聚焦AI、矽光子　600名專家共商半導體新局]]></title>
            <link>https://news.nextapple.com/finance/20260902/0F15CFBC5EE506C08EC7BAE798A15D19</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI重塑全球產業版圖，半導體成為經濟與國家安全關鍵。經濟部1日主辦「2026晶鏈高峰論壇」，由工研院與SEMI國際半導體產業協會共同執行，總統賴清德親自出席，現場匯聚全球超過600位政策官員及產業領袖、38國代表，以「信賴、韌性、共榮」為核心，共同探討AI時代半導體供應鏈新布局。]]></description>
            <pubDate>Wed, 02 Sep 2026 01:08:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[三星3D記憶體再進化！zHBM、zNAND-O亮相　喊話與台廠攻破兩道AI高牆]]></title>
            <link>https://news.nextapple.com/finance/20260901/58AAF5822B96B765BEB3070B44B03A57</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI持續推升記憶體需求，三星電子記憶體產品規劃部門副總裁崔璋石（Jangseok Choi）今（1）日在SEMICON Taiwan記憶體高峰論壇表示，傳統2.5D架構逐漸面臨資料傳輸距離及散熱限制，三星提出「CUBE」策略推進3D整合，並將下一波突破口瞄準「Z軸」，揭露新一代zHBM、zNAND-O藍圖，其中zHBM效能目標較HBM4E最高提升8倍，zNAND-O則預計2028年開始送樣。]]></description>
            <pubDate>Tue, 01 Sep 2026 19:57:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[Google擴AI晶片供應鏈！Marvell澄清非搶單　警告InP、大尺寸載板吃緊]]></title>
            <link>https://news.nextapple.com/finance/20260901/62BBA0DE8A5E6EBC5F50A128951DAF8B</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】Marvell資深副總裁Radha Nagarajan今（1）日表示，Google針對自研AI ASIC訂單導入Marvell，但並非將聯發科或博通（Broadcom）既有訂單移轉給Marvell，而是擴大AI晶片供應商陣容；另一方面，AI基礎設施快速成長，也使磷化銦（InP）晶圓及高品質、大尺寸載板面臨供應壓力。]]></description>
            <pubDate>Tue, 01 Sep 2026 17:44:00 +0800</pubDate>
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            <title><![CDATA[Marvell揭CPO商業化時程！NPO最快2027先行　台積電COUPE扮關鍵]]></title>
            <link>https://news.nextapple.com/finance/20260901/9D0C997B87D5BAE8328576953B778AF5</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】Marvell資深副總裁Radha Nagarajan今（1）日出席2026晶鏈高峰論壇聯訪記者會表示，近封裝光學（NPO）可望率先於2027至2028年進入市場，完整CPO則持續推進；隨著未來百萬顆XPU叢集走向分散式部署，光互連將從交換器一路延伸至XPU、機櫃甚至資料中心之間，台灣憑藉先進封裝、異質整合及模組製造能力，將是商業化重要基地。]]></description>
            <pubDate>Tue, 01 Sep 2026 17:39:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[先進封裝需求狂飆！日月光揭2大瓶頸　3DIC聯盟首納系統整合商]]></title>
            <link>https://news.nextapple.com/finance/20260901/E76842BB90371FD84A0899AD8E37D114</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI帶動3DIC與先進封裝需求持續升溫，日月光執行副總經理洪松井今（1）日在3DIC全球高峰論壇致詞表示，目前先進封裝成長面臨兩大瓶頸，日月光高雄地區正同步興建7棟廠房，對設備需求非常龐大。台積電先進封裝技術暨服務副總經理何軍則指出，面對技術每年迭代，產業必須採取平行開發並推動標準化，並宣布首度納入系統整合商。]]></description>
            <pubDate>Tue, 01 Sep 2026 17:20:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[沃旭大彰化二期920MW風場完工！在台總規模達1.82GW　年供電約200萬戶]]></title>
            <link>https://news.nextapple.com/finance/20260901/CF3127BF0E5A7302BFBF0663D2DD1370</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】全球離岸風電業者沃旭能源今（1）日舉行920MW大彰化西南第二階段及西北離岸風場完工暨運維儀式，這是繼2024年啟用900MW大彰化東南及西南第一階段風場後，沃旭在台建置的第二座近GW級大型離岸風場。隨著新風場完工，沃旭在台大彰化離岸風場群總裝置容量達1.82GW，每年發電量相當於全台約200萬戶家庭年用電量。]]></description>
            <pubDate>Tue, 01 Sep 2026 15:51:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[散熱成異質整合瓶頸！台積電： CoWoS放大功耗同步增　終極目標曝光]]></title>
            <link>https://news.nextapple.com/finance/20260901/9FBE344242C782642765E76001648143</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI算力快速擴張，先進封裝也從晶片整合走向系統級競賽。台積電先進封裝研發處長陳燕銘今（1）日在SEMICON Taiwan 2026異質整合國際高峰論壇表示，AI計算效能目前每年成長約4至5倍，推動硬體從SoC微縮轉向系統整合縮放，隨CoWoS尺寸與晶片數持續增加，單一封裝總功耗很快將增加6倍。他更在會後直言，散熱「不是將要成為瓶頸，而是已經是瓶頸」，台積電長期目標將朝取消TIM介面材料、讓微通道直接製作在晶片背面的TIM-less高度整合水冷架構發展。]]></description>
            <pubDate>Tue, 01 Sep 2026 12:36:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[環球晶徐秀蘭：矽晶圓產業未來2年價量齊揚　坦言台灣面臨2大壓力]]></title>
            <link>https://news.nextapple.com/finance/20260901/E849AD2F42342F508DF63C8AEDC867EF</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】環球晶（6488）董事長徐秀蘭今（1）日出席經濟部主辦、工研院與SEMI共同執行的「2026晶鏈高峰論壇」，她接受聯訪時表示，AI帶動的不是單一景氣循環，而是半導體需求的結構性改變，隨著客戶大規模擴產、既有廠區持續去瓶頸，未來2年矽晶圓產業「雙位數成長值得期待」，且成長將同時來自價格與出貨量改善。環球晶也持續布局先進封裝、CPO與矽光子，12吋SOI晶圓目前是CPO主要切入方向。]]></description>
            <pubDate>Tue, 01 Sep 2026 12:26:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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            <title><![CDATA[金融指數創新高！00919股價、配息雙創高　8月漲逾8%勝大盤]]></title>
            <link>https://news.nextapple.com/finance/20260901/FE3891990CB272A93D30FDFEF5957FED</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台股昨（31）日震盪走低，終場下跌202.98點、跌幅0.44%，不過金融股逆勢走強，多檔金控收紅，推升金融指數上漲1.88%，收3343.12點，改寫歷史新高。高含金量台股ETF同步受惠，其中群益台灣精選高息ETF（00919）8月含息上漲8.08%，優於大盤同期6.98%。]]></description>
            <pubDate>Tue, 01 Sep 2026 09:26:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[輝達35億美元投資點火！聯發科開盤飆漲停　股價重返4字頭]]></title>
            <link>https://news.nextapple.com/finance/20260901/3F988B12E47D72CB8DD09851558018F9</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】聯發科（2454）與輝達（NVIDIA）深化AI戰略合作，輝達斥資35億美元（約新台幣逾千億元）認購聯發科海外可轉債，激勵聯發科今（1）日股價開盤強勢直奔漲停，報在4315元。]]></description>
            <pubDate>Tue, 01 Sep 2026 09:12:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[00999A年化配息率衝10%！00935每股配息1.83元　9/15最後買進日]]></title>
            <link>https://news.nextapple.com/finance/20260901/20983F5FE87DCADBFFE87748C3ED0327</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台股近期受國際情勢、通膨與利率政策影響，市場波動加劇，不過AI投資循環與企業獲利仍具支撐。野村投信旗下主動野村臺灣高息ETF（00999A）、野村臺灣新科技50 ETF（00935）8月31日公布第一階段收益分配公告，00999A預估每單位配息0.29元，以31日收盤價11.42元計算，單次配息率2.54%、年化配息率10.16%；00935預估每單位配息1.83元，以收盤價57.30元計算，單次配息率3.19%、年化配息率6.39%。]]></description>
            <pubDate>Tue, 01 Sep 2026 01:37:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[台股震盪它逆勢衝！00757穩坐海外ETF股王　蓄勢挑戰歷史新高]]></title>
            <link>https://news.nextapple.com/finance/20260901/0F622537883E3F16722B7F57BAE7CD54</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台股31日盤中一度重挫881點，尾盤在MSCI盤後生效帶動下，最後一盤爆出3064億元大量，跌幅大幅收斂，終場下跌202.98點、收46128.47點，守住5日線及4萬6千點，成交值放大至1.2兆元。海外原型ETF則有18檔逆勢收紅，其中統一FANG+（00757）尾盤拉升至140元、收在最高價，漲幅居海外原型ETF之冠，續坐海外ETF股王寶座，距歷史高點142.35元僅一步之遙。]]></description>
            <pubDate>Tue, 01 Sep 2026 01:22:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[imec揭埃米世代技術路線！A7節點瞄準CFET　讚台灣AI供應鏈全球最強]]></title>
            <link>https://news.nextapple.com/finance/20260901/1451876F6860230FC5F9A7EA9E905889</link>
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            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】AI算力需求推動半導體持續朝埃米世代前進，全球半導體研發機構imec執行長范登納米勒（Patrick Vandenameele）在ITF Taiwan 2026主題演講後Q&amp;A表示，A7節點約2032至2033年前後，CFET仍是主要候選方案之一，High-NA EUV也將是持續微縮的重要技術。他並點出台灣優勢，從先進電晶體、晶圓製造、封裝一路到伺服器、機架與資料中心高度集中，在全球許多領域甚至是最強的生態系。]]></description>
            <pubDate>Tue, 01 Sep 2026 01:16:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[imec揭High-NA EUV微縮藍圖！先進製程拚極限　技術路線直達2040年代]]></title>
            <link>https://news.nextapple.com/finance/20260901/D684DB6FE3A361DD915DFFBB2B5E0EED</link>
            <guid isPermaLink="false">https://news.nextapple.com/finance/20260901/D684DB6FE3A361DD915DFFBB2B5E0EED</guid>
            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】全球半導體研發創新機構imec（全球微電子研發中心）於8月31日舉辦ITF Taiwan 2026技術論壇，新任執行長范登納米勒（Patrick Vandenameele）表示，AI正以前所未有的速度重塑產業，算力逐漸成為關鍵基礎設施，半導體持續微縮也更加困難。imec技術路線圖已延伸至2040年代初期，包括CFET、CMOS 2.0及新一代DRAM架構，而High-NA EUV將是推進先進節點微縮的重要工具。]]></description>
            <pubDate>Tue, 01 Sep 2026 01:10:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[聯發科獲輝達35億美元投資！黃仁勳、蔡力行揭深化合作　聚焦3大AI布局]]></title>
            <link>https://news.nextapple.com/finance/20260831/7FC90D308636F14B8B76F3B5C89829A1</link>
            <guid isPermaLink="false">https://news.nextapple.com/finance/20260831/7FC90D308636F14B8B76F3B5C89829A1</guid>
            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】聯發科（2454）與輝達（NVIDIA）今（31）日宣布深化長期合作，共同打造下一世代AI運算平台，範圍從AI基礎設施、本地AI運算一路延伸至汽車。聯發科同日晚間公告，39億美元（換算新台幣超過1200億元）海外第一次無擔保轉換公司債完成訂價，獲得輝達、Alphabet認購，其中輝達基於「長期策略合作」，將斥資35億美元認購，占發行總額近9成，雙方合作關係進一步升級。]]></description>
            <pubDate>Mon, 31 Aug 2026 21:12:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[台積電徐國晉揭先進封裝藍圖！CoWoS拚14倍光罩　CPO商業落地添信心]]></title>
            <link>https://news.nextapple.com/finance/20260831/0D73756F4EC9F116276CEA38EB03A46B</link>
            <guid isPermaLink="false">https://news.nextapple.com/finance/20260831/0D73756F4EC9F116276CEA38EB03A46B</guid>
            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】台積電研發副總經理徐國晉今（31）日在imec舉辦的ITF Taiwan 2026技術論壇表示，AI持續朝Scaling Up與Scaling Out發展，台積電正透過3DFabric異質整合平台支撐AI算力擴充。其中，CoWoS今年最大系統中介層尺寸達5.5倍光罩並進入量產，2029年預計突破14倍，CPO相關技術今年也開始量產，加速推動商業化落地。]]></description>
            <pubDate>Mon, 31 Aug 2026 20:20:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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        <item>
            <title><![CDATA[止血！正崴、永崴決議擬每股0.05元出清森崴能源持股]]></title>
            <link>https://news.nextapple.com/finance/20260831/5F9618B97360F2C8D586D776B966E95D</link>
            <guid isPermaLink="false">https://news.nextapple.com/finance/20260831/5F9618B97360F2C8D586D776B966E95D</guid>
            <dc:creator><![CDATA[呂承哲]]></dc:creator>
            <description><![CDATA[【記者呂承哲／台北報導】正崴精密（2392）與永崴投控（3712）今（31）日傍晚召開重訊記者會，兩家公司分別召開董事會，決議通過參與公開收購案，擬以每股新台幣0.05元處分所持有的森崴能源股權，正崴集團合計持股約14萬3280仟股，其中永崴投控持股約12萬1282仟股。]]></description>
            <pubDate>Mon, 31 Aug 2026 18:42:00 +0800</pubDate>
            <category><![CDATA[財經股市]]></category>

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